In BGA/CSP package assembly, the solder ball attach process is one of the major yield points that impacts the overall product yield and cycle time because it is the last process step to form electrical and mechanical connection to the complete package.
Alpha Advanced Materials spheres caters for ball grid array (BGA), chip scale packages (CSP) and flip chip bumping applications. We can meet your solder sphere specifications with a wide range of lead-free, eutectic, high lead and custom
alloys available in a variety of common diameters. ALPHA®spheres are made to the highest quality control standards to assure consistent sphere size, uniformity and alloy content.
ALPHA® Solder Sphere Attach - Paste Flux:
Product Name | Material Type | Deposition Method | Properties | Component Type | |||||
|---|---|---|---|---|---|---|---|---|---|
Pin Transfer | Dip | Halide Free | Activity | Vicosity | Tackiness | ||||
No Clean |
|
| o | o | Hi | Lo | Hi | BGA/FCCSP/POP | |
Epoxy | o | o | o |
| Lo | Hi | Hi | BGA/FCCSP/Wafer | |
Water Soluble | o | o | o | o | Hi | Hi | Hi | BGA/wafer | |
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Med | Hi | BGA/FCCSP | ||
o | o | o | o | Hi | Med | Hi | BGA/FCCSP | ||
o | o | o | o | Hi | Hi | Hi | BGA/FCCSP | ||
o | o | o | o | Hi | Med | Hi | BGA/FCCSP | ||
o | o | o | o | Hi | Med | Hi | BGA/FCCSP | ||
ALPHA® Solder Sphere Attach - Spheres:
Type | Alloy | Alloy | Tin(Sn) | Lead | Silver (Ag) | Bismuth (Bi) | Copper (Cu) | Melting Point (oC) | Attributes | ||
|---|---|---|---|---|---|---|---|---|---|---|---|
Eutectic | Solidus | Liquidus | |||||||||
Lead Free | Standard | 96.5 | -- | 3.5 | -- | -- | 221 | -- | -- | Eutectic Tin-Silver | |
95.5 | -- | 4.0 | -- | 0.5 | -- | 217 | 225 | Industry Standard Lead-Free | |||
96.5 | -- | 3.0 | -- | 0.5 | -- | 217 | 221 | Industry Standard Lead-Free | |||
98.3 | -- | 1.2 | -- | 0.5 | -- | 217 | 228 | Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) | |||
98.5 | -- | 1.0 | -- | 0.5 | -- | 217 | 228 | ||||
High Reliability | Modified SAC0307 Alloy | -- | 217 | 228 | |||||||
Modified SAC | -- | 212 | 220 | High thermal cycle resistance and better than standard drop shock performance | |||||||
Modified (Sb Free) | -- | 211 | 216 | ||||||||
Standard | 42 | -- | 0.4 | 57.6 | -- | 138 | -- | -- | Lead free low melting point | ||
Tin Lead | |||||||||||
62 | 36 | 2.0 | -- | -- | 179 | -- | -- | Eutectic Tin-Lead-Silver | |||
63 | 37 | -- | -- | -- | 183 | -- | -- | Eutectic Tin-Lead | |||
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