Retronix sets a new benchmark with the most advanced and reliable laser reballing process.

Retronix have installed a new top of the line system which will set a new benchmark for an advanced and reliable laser reballing service.

This new system provides reproducible solder bumping technology for packaging optoelectronic devices, MEMS, sensors, BGA’s, CLCC’s, CSP’s, Flip Chips and many more. Solder ball reflow is performed by a laser system using an infrared wavelength. All components of the system are integrated into a single cabinet.

Retronix are the only company to offer Laser Reballing, mitigating the need for an additional reflow thus protecting the device. With the introduction of the latest laser technology this gives Retronix the ability to laser high melt solder balls (HMP) down to 250 microns as well as plastic and copper cored solder balls.

Retronix are the only company with approvals from such customer as Leonardo Company, BAE Systems, Martin Baker Air Craft Company and many more high reliability companies are realising the need to minimise the amount of reflows you give any single component therefore using a laser to perform the reballing is the only way to guarantee that there is no long term damage to the silicon.