Retronix provides automated component re-tinning and chemical stripping of the Pb free or SnPb alloy coating. Our internal processes are optimised by component type, and are used to avoid solderability issues and convert lead free to lead alloy to mitigate tin whisker issues.
For all components with leads, QFP, TSOP, MSOP, PTH, sockets and axials, we offer a retinning process fully compliant with ANSI/GEIA-STD-0006. We can perform Pb to Pb free, Pb free to SnPb and re-tinning of existing alloys.
Retronix’s fully automated equipment ensures the processes do not expose the components to excessive heat, time or abrasion, are completely IC device safe and meets the reliability program requirements of ANSI/GEIA-STD-0006.
Applications Include:
- Convert any component from Lead Free to Lead Solder
- Convert any component from Lead to Lead Free Solder
- Double dip tinning for more relaible solder joints in harsh environments; eg. where heat and vibration exist. Double dip tinning suppresses oxidisation short term and therefore produces a much stronger solder joint during assembly.
- Remove Gold Finish from component terminations to avoid gold embrittlement issues.
STEP 1
The automated vacuum pickup arm transports the device from the carrier tray.
STEP 2
The device is fluxed, each side in sequence.
STEP 3
The device is pre-heated then temperature checked with a pyrometer.
STEP 4
Scavenging of the original alloy using a sacrificial solder pot. The alternative process is separate etchback.
STEP 5
Edge flux station
STEP 6
Pre-Heat & Temperature Check
STEP 7
Solvent wash then rinse. An alternative process is separate batch clean.
STEP 8
Device tinning with the replacement alloy.
STEP 9
The processed device is returned to the carrier tray.
or by filling up the form below.
the contact information written below.