Decapsulation of plastic molded packages
Decapsulation of plastic molded packages

Retronix can perform decapsulation of plastic molded packages using an automated etching system. This safe etchback system allows further investigation at the die level. Retronix uses this technique and method to further prove or disprove the authenticity of ICs.

We can also use decapsulation and high magnification analysis to check for signs of damage on the surface of an IC. This could be to check whether the die has been re-assembled or re-packaged or to verify whether a gross functional failure during IC test has been generated by physical damage or overstress.

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