Reflow oven with five (5) top and five (5) bottom vertical heating zones, the ERO-500 is an economic solution for low to medium volume production runs. Utilizing plenum convection heating technology, the ERO-500 provides uniform temperature profiling across the entire PCB board for enhanced SMT process control. With a maximum high soldering temperature of 320°C, the ERO-500 is compatible with most lead and lead-free solder paste profiles.
- 5 vertical heating zones plus 1 cooling zone
- Production status light tower included
- Clamshell hood design with mechanical struts
- Mesh belt or Edge rail conveyor units available
- Real time graphic temperature profiler to assist in profiling of board
- On-board LCD controller for easy and flexible programming control of reflow profile parameters
- The easy to program on-board LCD with graphic user interface enables independent zone programming and maximum flexibility in profile parameter control.
- Each heating zone is independently programmable and easily controlled through the on-board LCD controller
- Reflow profiling capability with on-board programming and ability to add
three thermocouples for specific board locations. - Reflow oven is Lead and Lead-free compatible
- PLUS, DDM is a true reflow oven manufacturer: designing, building, and customizing systems AND still selling parts for 30-year-old units – not a reseller
Max board width: 13″ (350mm)
Max board height: 1.375″ (35mm)
Heating zones: 5 top, 5 bottom
Max temperature: 608°F (320°C)
Heat tunnel length: 69″ (1745mm)
CyclonicsTM (forced air): Ten (10)
Conveyor extensions: N/A
Cooling station(s): One (1)
Venting: Three 4″ (102mm) dia. Flanges, 250 CFM (425m3/h) each
Cooling Zone Venting: N/A
Nitrogen option: N/A
PC Interface: Included
Overall dimensions (L x W x H): 98″ x 37″ x 50.5″ (2500mm x 945mm x 1280mm)
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