ESS Selective Soldering Machines
ESS Selective Soldering Machines

If you are considering automating your selective soldering process, then you need to consider the ESS Selective Soldering Machines. The cost of entry into automated, batch, selective soldering has never been easier with the ESS Selective Soldering Machines.

Designed for short run, mixed technology applications, the ESS310 & ESS500 Selective Soldering Machines will provide the throughput, accuracy, and reliability you are looking for to improve the productivity of your selective soldering process.

  • All-inclusive system – Flux, Preheat, Solder
  • Through-hole soldering flexibility – single point, drag, mini-wave, or dip soldering
  • Reproducible, “zero defect” solder joints
  • On-board, touch screen interface for easy instrument set-up, programming, and parameter control
  • Save machine setup time and increase productivity with off-line programming with photoscan and Gerber software
  • Flexibility with wettable and specialty nozzles

Max board size: ESS310: 310 x 310mm (12″ x 12″) ESS500: 500 x 500mm (19.7″ x 19.7″)
Min. Neighbor Component Clearance: 1.5 – 3mm (0.06″ – 0.12″) depending on nozzle size
Preheater: 100% IR preheat
Solder Capacity: Approx. 15kg (33 lbs)
Pressure (Nitrogen): 2 bar (30psi)
Flux System: Spray
Solder Pot and Pump: Lead-free, Single
Warm up Time: Approx. 45 minutes
Max Temperature: 400°C (725°F)
Consumption (Nitrogen): 0.8 – 1.7 CFM (23 – 49 litres/min) – dependent on nozzle and nozzle shroud
Air Pressure: 5.5 bar (80 psi)

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