Cost-effective mini-sized batch reflow oven provides forced air convection heating technology with individual time and temperature controls to make profile set up quick and easy. The single zone GF-B-HT comes in a table-top configuration or with an optional stand. It has a high temperature model capable of lead and lead-free soldering and 2 cooling stations making it the best reflow oven for the money.
This unique PCB shuttle system enables a higher throughput than standard batch ovens. Both sides of the oven have a cooling station. While one board is being processed, another board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow.
- Low-cost reflow oven best for small batch runs and prototypes.
- Large window allows the operator to see the board throughout the entire reflow process
- Unique shuttle system enables higher throughput than standard batch ovens
- All stainless steel interior construction provides for years of useful life
- Nitrogen gas inerting option available
- Maximum board size is 12″ x 12″ (305mm x 305mm)
- Compatible with lead and lead-free soldering applications
Max board width: 12″ x 12″ (305mm x305mm)
Max board height: 1.250″ (32mm)
Heating zones: One (1)
Max temperature: 315°C (600°F)
Heat tunnel length: NA
CyclonicsTM (forced air): One (1)
Conveyor extensions: Dual board shuttle
Cooling station(s): Two (2)
Venting: 4″ (102mm) flange with integral fan
Cooling Zone Venting: N/A
Nitrogen option: Yes
PC Interface: No
Overall dimensions (L x W x H): 38.13″ x 28.13″ x 14.5″ (968mm x 715mm x 368mm)
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