HyperSwash – High-Volume Universal System
HyperSwash – High-Volume Universal System
  • Fully automatic cleaning machine
  • Spray-in-air closed loop zero drain system
  • Multiple platform configuration
  • Superb for cleaning high volume of electronic assemblies


  • Defluxing – removing all kinds of solder residues
  • Cleaning of micromechanical components
  • Removing contamination from handling and board manufacturing, FOD
  • Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, BTC, QFN, MELF
  • Cleaning of power electronics
  • For electronic assemblies requiring extra short process time
  • Ideal for second side misprints on complex assemblies
  • Cleaning before conformal coating and wire bonding

Head-Tech offers a turn-key solution for the cleaning process, including materials, process, and equipment. Contact us for the product bulletin and Safety Data Sheet.

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