HyperSwash – High-Volume Universal System
- Fully automatic cleaning machine
- Spray-in-air closed loop zero drain system
- Multiple platform configuration
- Superb for cleaning high volume of electronic assemblies
APPLICATIONS
- Defluxing – removing all kinds of solder residues
- Cleaning of micromechanical components
- Removing contamination from handling and board manufacturing, FOD
- Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, BTC, QFN, MELF
- Cleaning of power electronics
- For electronic assemblies requiring extra short process time
- Ideal for second side misprints on complex assemblies
- Cleaning before conformal coating and wire bonding
Head-Tech offers a turn-key solution for the cleaning process, including materials, process, and equipment. Contact us for the product bulletin and Safety Data Sheet.
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