Convert Lead Free ICs to Lead Safely
Alloy Conversion | Convert Lead Free ICs to Lead
Why Convert Lead Free ICs to Lead?
Many High Reliability industries are exempt from using lead free processes, they continue to use lead solder in PCB assemblies. One of the dilemmas facing this industry though is sourcing lead ICs. Lead free is by far the most dominant process in terms of volume. Therefore IC manufacturers are more reluctant to design lead ICs as the small volumes make it uncompetitive.
Therefore the Hi-Rel industries have to convert lead free ICs to lead in their processes.
Retronix has the only process in the world that does this safely, i.e. without any reflow cycles that could damage the IC by exposing it to more reflows than are recommended.
How is this done for BGA’s?
Lead free spheres are removed by an air knife in an automated process – no reflow or abrasion to damage the resist or pads.
New spheres are attached by laser – no reflow. Retronix also have auto clean, AOI inspection for mechanical properties, and electrical test to verify the process.
STEP 1
The automated vacuum pickup arm transports the device from the carrier tray.
STEP 2
The device is fluxed, each side in sequence.
STEP 3
The device is pre-heated then temperature checked with a pyrometer.
STEP 4
Scavenging of the original alloy using a sacrificial solder pot. The alternative process is separate etchback.
STEP 5
Edge flux station
STEP 6
Pre-Heat & Temperature Check
STEP 7
Solvent wash then rinse. An alternative process is separate batch clean.
STEP 8
Device tinning with the replacement alloy.
STEP 9
The processed device is returned to the carrier tray.
Note: The traditional Reflow Reballing is also offered by Retronix.
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