lead-free, no-clean solder paste designed for a broad range of applications. broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. engineered to deliver the comparable performance to a tin lead process.yields excellent print capability performance across various board designs and, particularly, with ultra-fine feature repeatability (11 mil Squares) and high throughput applications.
Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-T is formulated to deliver exceptional visual joint cosmetics. Additionally, ALPHA OM-338-T’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. ALPHA OM-338-T is also known as ALPHA OM-338 with M13 viscosity.
Features & Benefits:
- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness.
- Excellent print consistency with high process capability index across all board designs.
- Print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput.
- Wide reflow profile window with good solderability on various board / component finishes.
- Excellent solder and flux cosmetics after reflow soldering
- Reduction in random solderballing levels, minimizing rework and increasing first time yield
- Meets highest IPC 7095 voiding performance classification of Class III.
- Excellent reliability properties, halide-free material
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