lead-free, no-clean solder paste designed for a broad range of applications. provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly, with ultra-fine feature repeatability and high “through-put” applications.
Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. deliver excellent visual joint cosmetics and best in class in circuit pin test yields. capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
Features & Benefits:
- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200μm (8 mil) with 100μm (4 mil) thick stencils
- Excellent print consistency with high process capability index across all board designs
- Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput
- Wide reflow profile window with good solderability on various board / component finishes
- Excellent solder and flux cosmetics after reflow soldering
- Best in class low defect rate for Head in Pillow
- Best in class in circuit pin test yield
- Reduction in random solderballing levels, minimizing rework and increasing first time yield
- Meets highest IPC 7095 voiding performance classification of Class III
- Excellent reliability properties, halide-free material
- Compatible with either nitrogen or air reflow
- Zero halogen (No halogen intentionally added to the formulation)
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