OM-353 – Enabling Ultra-Fine Feature Printing
Enabling Ultra-Fine Feature Printing
OM-353 – Enabling Ultra-Fine Feature Printing

designed to meet market segments requiring ultra-fine feature applications. It has been tested to give excellent printing performance down to 180μm pad size.

No-Clean, Lead-Free, Zero-Halogen, ROL0, Ultra-Fine Feature Print & Air Reflow Capable Solder paste:

  • Type 4 & Type 5 no-clean paste
  • Available in 500 gram jars, 6” & 12” cartridges
  • Available in SAC305, SAC105, SACX™ Plus 0307, Maxrel™, & Maxrel™ Plus alloys

Assembly processes that can gain from ALPHA® OM-353 Solder Paste are:

  • Assemblies with fine features
  • Assemblies sensitive to component warpage
  • Processes that currently require cleaning
  • Components sensitive to flux wicking
  • Assemblies which do not require SAC305

key attributes are:

  • Long Stencil Life: engineered for consistent performance in warm/humid production climates, reducing variations in print performance and paste dry-out.
  • High Tack Force Life: ensures high pick-and-place yields, good self-alignment.
  • Wide Reflow Profile Window: enables quality soldering of complex, high density PWB assemblies in an N2 environment, using high ramp rates and soak profiles as high as 170°C to 180°C.
  • Reduced Mid Chip Solder Balling, Head-in-Pillow: minimizes rework and increases first time yield
  • Air Reflow Capable: shown to yield good coalescence for 160µm circle deposits using an air reflow high soak.
  • Excellent Solder Joint and Flux Residue Cosmetics: residue does not char or burn after
If you have any questions don’t hesitate to contact us directly
or by filling up the form below.

    (All fields are required)

    Feel free to contact us through
    the contact information written below.