Features and Benefits

• Excellent Voiding Performance: Exceeds IPC7095 Class III Requirement.
• Wide Reflow Profile Window: Enables high quality solderability of complicated, high density
• PCB assemblies using straight ramp and soak profiles, as high as 150° to 200°C soak.
• Good Random Solder Ball Levels: Minimizes rework and increases first pass yield.
• Good Coalescence and Wetting Performance: Demonstrated good wetting and coalescence properties.
• Excellent Solder Joint and Flux Residue Cosmetics: Clear post reflow residue appearance with no charring or burning.
• Long, Stable Tack Force Life: Ensures high pick-and-place yields, good self-alignment.
• Halogen Content: Halogen free, no halogens intentionally added.
• Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements (see table below), as well as TOSCA & EINECS.
• Good Hot and Cold Slump Characteristics: Passes IPC ANSI / J STD-005 acceptance criteria.

Product Information

• Alloys: SAC305, Innolot™, & Maxrel Plus Alloys
• For other alloys, contact your local Alpha Sales Office
• Powder Size: Type 4
• Packaging Sizes: 500 gram jars, 6” cartridges, ProFlow Cartridge
• Flux Gel: Flux gel is available in 10 and 30 cc syringes for rework applications
• Lead Free: Complies with RoHS Directive 2002/95/EC

Application

Formulated for both standard and fine pitch stencil printing at speeds between 25 mm/sec (1”/sec) and 100 mm/sec (4”/sec), with stencil thickness of 0.100mm (0.004”) to 0.150mm (0.006”), particularly when used in conjunction with ALPHA Stencils. Typical blade pressures are between 0.21 – 0.36 kg/cm of blade (1.25 -1.5 Ibs/inch of blade), depending upon the print speed. The higher the print speed, the higher the blade pressure that is required to achieve a clean stencil surface. The reflow process window will give high first pass soldering yield with good cosmetics and minimized rework.