Offering the world’s leading safe QFP recovery process – RETRONIX’S 7 STEP QFP RECOVERY PROCESS.
Every day millions of dollars of brand new components are scrapped by manufacturers because they are attached to faulty PCBs. If these components could be safely reused after careful IC Recovery in some rare cases IC repair, these companies would save huge amounts of money in recovered scrap, provide much needed “allocated” components and also reduce the amount and cost of landfill. An added bonus is that it would also seriously damage the counterfeit industry, whose raw material supply would be reduced.
The reason companies do not reuse these devices is due to worries over reliability:
Is the chip you want to re-use the reason that the PCB failed?
It’s been well proven over time that very few of these failed PCBs are caused by bad silicon. At least 70% of scrap is created by solder paste issues alone. Retronix also puts every component through a rigorous test process to eliminate electrical and mechanical failures.
What if the component is damaged during removal or refurbishment?
Retronix offers the only safe IC recovery process on the market. We can remove and refurbish your components using no reflow cycles and no abrasive processes – and each part of our process is fully controlled and repeatable.
STEP 1: Prebake
Each PCB is prebaked to Jedec standard to remove moisture.
STEP 2: Component Removal
Components are removed using a process that sacrifices the PCB in order to protect the IC, and avoids normal reflow cycles on the IC. Our thermal cycle is much shorter (under 30 seconds) and at a far lower temperature.
STEP 3: Excess Solder Removal
Solder is removed in a controlled process. Conforming to industry standards.
STEP 4: Clean
Components are cleaned in an automatic process. As the components are loose they are cleaned to a much higher standard than if they were assembled on a PCB. Our process uses DI water rinse and measurement of water cleanliness.
STEP 5: Mechanical Test
Components are run through a scanner, which checks mechanical characteristics such as pitch, lead deviation, sweep and slant.
STEP 6: Optional Electrical Test
We offer curve trace, programming, functional test among others to verify the performance of the component.
STEP 7: Rebaked & Packed
Components are then put in tape or tray, vacuum sealed with desiccant, then labelled and shipped.
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