Wafer bumping technology provide high performance, form factor and cost advantages in a smallest semiconductor package. The solder bumps used in wafer level packaging need to demonstrate both high electrical and high mechanical reliability during the lifetime of the product. Alpha Solder spheres, Paste fluxes offer industry leading wafer ball attach solution to meet those requirement. Alpha liquid fluxes provide robust wafer bump reforming processes for wafer bumping applications that utilize electroplated solder bumping processes.
Wafer Bumping - Paste Flux:
Product Name | Material Type | Deposition Method | Properties | Component Type | |||||
|---|---|---|---|---|---|---|---|---|---|
Pin Transfer | Dip | Halide Free | Activity | Vicosity | Tackiness | ||||
Epoxy | o | o | o |
| Lo | Hi | Hi | BGA/FCCSP/Wafer | |
Water Soluble | o | o | o | o | Hi | Hi | Hi | BGA/wafer | |
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Med | Hi | BGA/wafer | ||
o | o | o | o | Hi | Med | Hi | BGA/FCCSP | ||
Wafer Bumping - Sphere:
Type | Alloy | Alloy | Tin(Sn) | Lead | Silver (Ag) | Bismuth (Bi) | Copper (Cu) | Melting Point (oC) | Attributes | ||
|---|---|---|---|---|---|---|---|---|---|---|---|
Eutectic | Solidus | Liquidus | |||||||||
Lead Free | Standard | 96.5 | -- | 3.5 | -- | -- | 221 | -- | -- | Eutectic Tin-Silver | |
95.5 | -- | 4.0 | -- | 0.5 | -- | 217 | 225 | Industry Standard Lead-Free | |||
96.5 | -- | 3.0 | -- | 0.5 | -- | 217 | 221 | Industry Standard Lead-Free | |||
98.3 | -- | 1.2 | -- | 0.5 | -- | 217 | 228 | Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) | |||
98.5 | -- | 1.0 | -- | 0.5 | -- | 217 | 228 | ||||
High Reliability | Modified SAC0307 Alloy | -- | 217 | 228 | |||||||
Modified SnCu (Zero Silver) Alloy | -- | 227 | 229 | Low cost zero Silver alloy | |||||||
Modified SAC | -- | 212 | 220 | High thermal cycle resistance and better than standard drop shock performance | |||||||
Modified (Sb Free) | -- | 211 | 216 | ||||||||
Modified SnBi Alloy | 138 | -- | -- | Low temperature high reliability lead free alloy | |||||||
Standard | 42 | -- | 0.4 | 57.6 | -- | 138 | -- | -- | Lead free low melting point | ||
Tin Lead | 10 | 90 | -- | -- | -- | -- | 275 | 302 | High-Lead for high stand off | ||
62 | 36 | 2.0 | -- | -- | 179 | -- | -- | Eutectic Tin-Lead-Silver | |||
63 | 37 | -- | -- | -- | 183 | -- | -- | Eutectic Tin-Lead | |||
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