ALPHA® EF-Series fluxes offer environmentally friendly benefits, while providing unmatched soldering performance. The ALPHA soldering flux line is unsurpassed in providing wave soldering process solutions. Its alcohol-based fluxes provide excellent wetting, virtually defect-free soldering and high line throughput across the full range of applications.
Our latest line of wave solder fluxes, including our EF-Series, is designed to provide the highest level of performance and reliability in its class.
Specific wave solder flux products were formulated to offer a safer and more environmentally friendly alternative to ordinary fluxes. Alpha fluxes have been developed using the latest Alpha flux technology. We operate many Liquid Soldering flux production facilities around the world, and each of these sites follows strict standards that assure high product quality and unmatched consistency.
Product | Technology | Solids Content | Electrical Reliability | Best Used On Assembly Types | Halide Free | Pin Testability | ||||
|---|---|---|---|---|---|---|---|---|---|---|
IPC-JSTD -004A | IPC-JSTD -004B | JIS/ Custom | Bellcore SIR | OPL/ MIL | ||||||
Water-Based | ||||||||||
Rosin-Free No-Clean | Low | X |
|
| X |
| II,III | X | High | |
Low | X |
|
| X |
| II,III | X | High | ||
Water Soluble | High | X |
|
|
|
| II,III,IV |
| High* | |
High | X |
|
|
|
| II,III,IV |
| High* | ||
Low-VOC | ||||||||||
Rosin-Containing No-Clean | Low | X |
| X |
|
| I,II | X | Moderate | |
Alcohol-Based | ||||||||||
Rosin-Free No-Clean | Low | X |
|
|
|
| II, III | X | Very Good | |
Low | X |
|
| X |
| II,I II | X | Very Good | ||
Low | X |
|
| X |
| I, II, III | X | Very Good | ||
Rosin-Containing No-Clean | Low | X |
| X | X |
| I, II, III | X | Very Good | |
Low | X | X |
| X |
| II, III | X | Moderate | ||
Low | X | X | X | X |
| II, III | X | Very Good | ||
Low | X | X | X |
| II, III | X | Very Good | |||
Low | X | X | X | X |
| I, II, III | X | Very Good | ||
Med | X |
| X | X |
| II, III, IV | X | Moderate | ||
Med | X |
|
| X |
| I, II, III | X | Moderate | ||
Med | X |
| X | X |
| I, II, III |
| Moderate | ||
High | X | X | X | X | X | I, II, III |
| Low | ||
High | X |
| X | X | X | I, II |
| Low | ||
High | X | X | X | X |
| II, III, IV | X | Moderate | ||
Water-Soluble | High | X* | X* | X* | X* |
| II, III, IV |
| High* | |
WS-870-25 | High | X* |
|
|
|
| II, III, IV |
| High* | |
Assembly Type | |||
|---|---|---|---|
I | II | III | IV |
Simple, single sided, FR2 / CEM-1 laminates | Dual sided FR-4 w/ PTH's, 1.6mm thick, up to 4 inner copper layers, metallized pad finishes | Complex, up to 12 inner copper layers, OSP pad finishes, all processing in air | >2.4mm thick, >12 inner copper layers, large high heat capacity components |
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