ATROX® Brand of conductive die attach pastes are designed to provide you with superior performance for todays stringent reliability requirements. The conductive die attach products ( ATROX®) offer complete solution with lower total cost of ownership ushering a new era of high performance materials.
Product Name | Format | Deposition Method | Thermal (W/m-k) | Key Features | Component Type | |||
|---|---|---|---|---|---|---|---|---|
Wafer Lamination | Dispense | Bare Silicon Compatibility | Modulus | |||||
ATROX® | Paste |
| o |
| High |
| High | SO, TO, QFN, TSSO |
ATROX® | Paste |
| o | o | Extreme |
| Mid | QFN, SO, TO, TSSO, Cu Clip |
ATROX® 800HT2V-P1 | Paste |
| o | Extreme |
| Low | QFN, SO, TO, TSSO, LGA, QFP | |
ATROX® | Paste |
| o | o | High | o | Low | QFP, QFN, LGA, SO, BGA |
ATROX® | Paste |
| o | High | o | Low | QFP, QFN, LGA, SO, BGA | |
ATROX® 800HT7A1 | Paste |
| o | o | High | o | Low | QFN, SO, TO, TSSO, LGA, QFP |
ATROX® | Paste |
| o |
| Extreme | o | Mid | QFN, BGA, SO, TO |
ATROX® | Paste |
| o |
| High | o | Low | QFN, SO, TO, TSSO, LGA, QFP |
ATROX® | Paste |
| o |
| Low | o | Low | QFN, SO, BGA, QFP, TSSO, LGA |
ATROX® | Film | o |
|
| Low | o | Low | QFN, SO, BGA, QFP, TSSO, LGA |
ATROX® | Film | o |
|
| High | o | Mid | QFN, SO, BGA, QFP, TSSO, LGA, TO |
ATROX® 5904HT1 | Paste |
| o | Medium | o | Low | QFN, SO, TSSO | |
ARGOMAX® 8035 | Film | o |
|
| Extreme |
| High | Power Modules and Discretes |
ARGOMAX® 2030 | Paste |
| o | o | Extreme |
| High | Power Modules |
ATROX | Paste |
| o | o | Low | o | Low | LED packages |
ATROX® | Paste |
| o | o | Medium | o | Mid | LED packages |
ATROX® | Paste |
| o | o | High | o | High | LED packages |
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