Alpha Advanced Materials offers high performance conductive thermoplastic and thermosetting polymer bonding products for thermal management of semiconductor and electronics applications . These products cover a complete range of mechanical, electrical and thermal properties and be used for temporary mounting or permanent bonding. Specific enabling products support stringent industry reliability standards; including JEDEC and MIL specification.
Product Name | Format | Deposition Method | Properties | Application | |||||
|---|---|---|---|---|---|---|---|---|---|
Wafer Lamination | Pick & Place | Dispense | Reworkable | Thermal (W/m-k) | Tg | ||||
STAYSTIK® 181AK | Paste |
|
| o | o | o | Low | Mid | Lid seal, substrate attach |
STAYSTIK® | Film | o | o |
|
|
| Low | High | Low Temp lamination, substrate, backplane attach |
POLYSOLDER | Paste |
|
| o | o |
| Medium | Mid | Substrate attach, DCA. COB attach, Lid seal |
STAYSTIK® | Film | o | o |
|
| o | Low | Low | Substrate, backplane attatch |
STAYSTIK® | Film | o | o |
|
| o | Low | Mid | Substrate, back plane attach |
ATROX® | Film | o |
|
|
|
| Low | High | Die attach |
ATROX® | Film | o |
|
|
|
| High | High | Die attach |
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