Alpha Advanced Materials offers high performance electrically insulating thermoplastic and thermosetting polymer bonding products for thermal management of semiconductor and electronics applications. These products cover a complete range of mechanical, electrical and thermal properties and be used for temporary mounting or permanent bonding. Specific enabling products support stringent industry reliability standards; including JEDEC and MIL specification.
Product Name | Format | Deposition Method | Reworkable | Application | |||||
|---|---|---|---|---|---|---|---|---|---|
Water Lamination | Pick & Place | Dispense | Spin Coat | Dippable | |||||
STAYCHIP® | Paste |
|
| o |
|
| o |
| Encasulation, Dam and fill |
STAYCHIP® | Paste |
|
| o |
|
| o |
| Encasulation, Dam and Fill |
STAYCHIP® F6142 | Paste |
|
| o |
|
| o |
| Lid attach |
STAYSTIK® | Paste |
|
|
| o |
| o | o | Wafer Thinning, Lens polishing |
STAYSTIK® | Paste |
|
|
| o |
| o | o | Wafer Thinning, Lens polishing |
STAYCHIP® | Paste |
|
| o |
|
| o |
| Underfilling |
STAYSTIK® | Film | o | o |
|
|
|
| o | Module attach, Thermal Management |
STAYSTIK® | Film | o | o |
|
|
|
| o | Module attach, Thermal Management |
STAYSTIK® | Film | o | o |
|
|
|
| o | Module attach, Thermal Management |
STAYCHIP® | Paste |
| o | o |
| o |
| o | Dual sided solder joint reinforcement material |
STAYCHIP® | Paste |
| o | o |
| o |
| o | Dual sided solder joint reinforcement material |
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