most exceptional and versatile range of materials for die attach (ATROX® Argomax®) used in semiconductor packaging and LED markets. Alpha Advanced Materials’ ATROX® brand of ATROX® die attach paste and ATROX® die attach film products offer excellent reliability and high throughput for various packages.
Alpha Advanced Materials products are die attach paste for ATROX® 800HT2, ATROX® 800HT5, ATROX® 800HT5, etc and die attach film for ATROX® CF.100-7B and ATROX® CF.200-1D
Product Name | Format | Deposition Method | Thermal (W/m-k) | Key Features | Component Type | |||
|---|---|---|---|---|---|---|---|---|
Water Lamination | Dispense | Bare Silicon Compatibility | Modulus | |||||
Paste |
| o |
| High |
| High | SO, TO, QFN, TSSO | |
Paste |
| o | o | Extreme |
| Mid | QFN, SO, TO, TSSO, Cu Clip | |
Paste |
| o | o | High | o | Low | QFP, QFN, LGA, SO, BGA | |
Paste |
| o |
| Extreme | o | Mid | QFN, BGA, SO, TO | |
Paste |
| o |
| High | o | Low | QFN, SO, TO, TSSO, LGA, QFP | |
Paste |
| o |
| Low | o | Low | QFN, SO, BGA, QFP, TSSO, LGA | |
Film | o |
|
| Low | o | Low | QFN, SO, BGA, QFP, TSSO, LGA | |
Film | o |
|
| High | o | Mid | QFN, SO, BGA, QFP, TSSO, LGA, TO | |
Paste |
| o | o | Medium | o | Low | QFN, SO, TSSO, LGA | |
Paste |
| o | o | Low | o | Low | LED packages | |
Paste |
| o | o | Medium | o | Mid | LED packages | |
Paste |
| o | o | High | o | High | LED packages | |
Film | o |
|
| Extreme |
| High | Power Modules and Discretes | |
Paste |
| o | o | Extreme |
| High | Power Modules | |
Die Attach - Solder Paste:
Product Name | Material Type | Deposition Method | Properties | Powder Size | Component Type | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Dispense | Dip | Halide Free | Activity | Tackiness | Fine Pitch Capable | Lead Free | Type 3 | Type 4 | Type 5 | Type 6 | ||||
No Clean | o |
|
| o | Hi | Hi |
|
| o |
|
|
| Leadframe | |
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