alpha Advanced Materials liquid flux are formulated to provide unrival soldering performance for flip chip and wafer level processing. AAM fluxes are developed using the latest Alpha flux technology. Our latest line of liquid flux offer application for convention flip chip reflow to ultra-low residue thermo-compression bonding process and also provides highest level of performance for electroplated wafer bump reform process. AAM offer both No-clean and water soluble liquid flux solutions to meet every customer application needs.