Alpha Paste flux offers industry leading soldering performance for semiconductor packaging applications. The latest range of AAM paste flux are formulated with latest Alpha halogen free flux technology to deliver high activity, long stencil and shelf life.
AAM No-clean and Water soluble paste flux delivers robust and high yield for solder ball attach, flip chip and other soldering applications. AAM water soluble paste flux is the leading choice of solder flux for wafer level CSP and BGA/ CSP ball attach applications.
Product Name | Material Type | Deposition Method | Properties | Component Type | |||||
|---|---|---|---|---|---|---|---|---|---|
Pin Transfer | Dip | Halide Free | Activity | Viscosity | Tackiness | ||||
No Clean | o | o | o |
| Hi | Med | Hi | BGA/FCCSP | |
o |
| o | o | Hi | Med | Hi | BGA/FCCSP | ||
o |
| o | o | Lo | Med | Hi | BGA/FCCSP | ||
|
| o | o | Hi | Lo | Hi | BGA/FCCSP/POP | ||
Epoxy | o |
| Lo | Hi | Hi | Wafer | |||
Water Soluble | o | o | o |
| Lo | Med | Hi | FCCSP | |
| o | o |
| Lo | Lo | Lo | FCCSP | ||
o | o | o | o | Hi | Hi | Hi | BGA/FCCSP | ||
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Hi | Hi | BGA/wafer | ||
o | o | o | o | Hi | Med | Hi | BGA/wafer | ||
o | o | o | o | Hi | Med | Hi | BGA/FCCSP | ||
o | o | o | o | Hi | Med | Hi | BGA/FCCSP | ||
o | o | o | o | Hi | Hi | Hi | BGA/FCCSP | ||
o | o | o | o | Hi | Med | Hi | BGA/FCCSP | ||
o | o | o | o | Hi | Med | Hi | BGA/FCCSP | ||
o | o | o | o | Hi | Hi | Hi | BGA/FCCSP | ||
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