Paste Flux

Alpha Paste flux offers industry leading soldering performance for semiconductor packaging applications. The latest range of AAM paste flux are formulated with latest Alpha halogen free flux technology to deliver high activity, long stencil and shelf life.

AAM No-clean and Water soluble paste flux delivers robust and high yield for solder ball attach, flip chip and other soldering applications. AAM water soluble paste flux is the leading choice of solder flux for wafer level CSP and BGA/ CSP ball attach applications.

Product Name

Material Type

Deposition Method

Properties

Component Type

Pin Transfer

Print

Dip

Halide Free

Activity

Viscosity

Tackiness

NCX340

No Clean

o

o

o

Hi

Med

Hi

BGA/FCCSP

NCX-390

o

o

o

Hi

Med

Hi

BGA/FCCSP

NCX402

o

o

o

Lo

Med

Hi

BGA/FCCSP

POP707

o

o

Hi

Lo

Hi

BGA/FCCSP/POP

NCX PRL-507

Epoxy

o

Lo

Hi

Hi

Wafer

WS3018-HA


Water Soluble

o

o

o

Lo

Med

Hi

FCCSP

WS3018-LV

o

o

Lo

Lo

Lo

FCCSP

WS608

o

o

o

o

Hi

Hi

Hi

BGA/FCCSP

WS600

o

o

o

o

Hi

Hi

Hi

BGA/wafer

WS600-MHV

o

o

o

o

Hi

Hi

Hi

BGA/wafer

WS9180-MHV

o

o

o

o

Hi

Hi

Hi

BGA/wafer

WS9190

o

o

o

o

Hi

Hi

Hi

BGA/wafer

WSX-HF-HAHV

o

o

o

o

Hi

Hi

Hi

BGA/wafer

WS9160-M7

o

o

o

o

Hi

Med

Hi

BGA/wafer

WS9180-M7

o

o

o

o

Hi

Med

Hi

BGA/FCCSP

WSX-HAHF

o

o

o

o

Hi

Med

Hi

BGA/FCCSP

WSX-9200

o

o

o

o

Hi

Hi

Hi

BGA/FCCSP

WSX-1207

o

o

o

o

Hi

Med

Hi

BGA/FCCSP

WSX-1405HV

o

o

o

o

Hi

Med

Hi

BGA/FCCSP

WSX9284

o

o

o

o

Hi

Hi

Hi

BGA/FCCSP

If you have any questions don’t hesitate to contact us directly
or by filling up the form below.

    (All fields are required)

    Feel free to contact us through
    the contact information written below.